fbi2.5a 4s1 50 fbi2.5b 4s1 100 fbi2.5d 4s1 200 fbi2.5g 4s1 400 fbi2.5j 4s1 600 fbi2.5k 4s1 800 fbi2.5m 4s1 1000 ?mounting instructions high temperature soldering guaranteed: 260 ? ?10 sc. recommended mounting torque: 8 kg.cm. fbi2.5a4s1.......fbi2.5m4s1 2.5 amp. glass passivated bridge rectifier dimensions in mm. maximum ratings, according to iec publication no. 134 peak recurrent reverse voltage (v) max. average forward current with heatsink without heatsink 8.3 ms. peak forward surge current rating for fusing ( t<8.3 ms.) dielectric strength (terminals to case, ac 1 min.) operating temperature range storage temperature range i fsm i 2 t v dis t j t stg 4.5 a at 65 ? 2.5 a at 25 ? 100 a 41 a 2 sec 1500 v ?55 to + 150 ? ?55 to +150 ? voltage 50 to 1000 v. current 2.5 a. v rrm i f(av) plastic case (jedec method) electrical characteristics at tamb = 25? v f max. forward voltage drop per element at i f = 2.5 a i r 1.0 v max. reverse current per element at v rrm 5 a maximum thermal resistance junction-case. with heatsink. junction-ambient. without heatsink. 12 ?/w 40 ?/w r th (j-c) r th (j-a) 20 4 1 0.5 3.5 + _ 4 4 0.8 + 0.05 l suffix 13.5 7 ? ?glass passivated junction chips. ul recognized under component index file number e320541. lead and polarity identifications. case: molded plastic. ideal for printed circuit board (p.c.b.). the plastic material carries u/l recognition 94 v-o. dec - 08 35 70 140 280 420 560 700 maximum rms voltage (v) v rms
v f , instantaneous forward voltage (v) 0.6 1.0 1.4 0 0.1 1.0 10 tamb = 25?c characteristic curves fbi2.5 - 4s1 tamb, ambient temperature ( c) 1 3 4 5 0 50 100 150 175 0 125 25 75 typical forward characteristic forward current derating curve 2 maximum non-repetitive peak forward surge current number of cycles at 60 hz. 10 100 0 25 50 75 100 1 heatsink tc tc sine wave r-load on heatsink + _ on glass-epoxi substrate p.c.b. soldering land 5 mm sine wave r-load free in air dec - 08 + _
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